WAFER CLEANING APPARATUS

摘要

A method and apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is located vertically between the first and second brushes and rests on a pair of rollers. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with the rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.