摘要 |
The adhesive joints (1) are made at the surface (2), or within the guide holes (5) of a board, and are at an arbitrary angle in a stack of boards (3) made of silicon, to fit wires, glass fibres or micro-mechanical components permanently. The upper part, or upper layers, of the boards can have elongated holes (5a) to provide an adhesive reservoir, allowing a high viscosity, thixotropic adhesive to be used. The remainder of the holes (5b) are cylindrical, and of smaller size. Hundreds of closely spaced wire contacts, of 25 to 100 micron diameter, can be glued into the boards as test probes for the buckling beam tests. |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US |
发明人 |
DRUSCHKE, FRANK, DR., 70597 STUTTGART, DE;ELSNER, GERHARD, DR., 71067 SINDELFINGEN, DE;GRESCHNER, JOHANN, DR., 72124 PLIEZHAUSEN, DE;STOEHR, ROLAND, 71154 NUFRINGEN, DE |