Complex power electronic module e.g. for converters of variable speed drives
摘要
A solid state switching module has a printed circuit substrate 12 on to which a number of single power chips 20 are located. conductor tracks are formed in strips along both edges 18 and these are connected to the chips by bond wires 22. Contact pins 16 for external connection are located along the edges of a housing of insulating material. A heat sink may be placed against the underside of the substrate.
申请公布号
DE19627858(A1)
申请公布日期
1998.01.22
申请号
DE1996127858
申请日期
1996.07.11
申请人
EUROTEC GESELLSCHAFT FUER ENERGIESPARTECHNIK MBH, 24589 NORTORF, DE