| 摘要 |
A modular control system (100) of a semiconductor workpiece processing tool (10) having a plurality of semiconductor workpiece processing modules (12). The control system preferably operates and monitors the processing modules, a workpiece conveyor and an interface section. The preferred modular control system is constructed in a modular master/slave arrangement having a grand master controller (101), and master controllers (130, 131, 132) which communicate with slave controllers (140-148) which in turn are connected to monitor and control subsystems of the processing tool.
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