Self-aligned metal wiring manufacture for semiconductor component

摘要

The metal wiring manufacture uses an insulation film (33) applied to the semiconductor substrate (31), overlaid by a conductor layer (35), a second insulation layer (37) and a photosensitive film (39). The latter is selectively exposed and developed to provide a contact hole structure, with etching of the exposed area to form the contact hole (41), before exposure and development of the remainder of the photosensitive film and etching to provide a recess around the contact hole. The photosensitive layer is removed and the contact hole and the recess are filled with a conductive material in electrical contact with the conductive layer.