METHOD OF FOR WORKING CLAD PLATE

摘要

A method of and device for working a clad plate to be used as a lead frame for a flat package type integrated circuit. A metallic foil in a specified size is overlaid on a material in the shape of a strip at a specified position, pressed and rolled into a continuous clad material, and, when boring reference holes in the clad material, exact positioning is performed between not only reference holes but also the metallic foil formed on the clad plate beforehand and the reference holes, whereby, even when pitches between a plurality of reference holes in the clad plate are different from each other, continuous press work using a metallic die and depending on these reference holes is performed.