Fuse in a semiconductor integrated circuit

摘要

The fusible link is in the form of a conductor path (4) with a section of reduced cross-section at the fuse point, with a hollow space (H) adjacent at least one surface of the fuse point. Pref. the hollow space is provided in the layers (2,3) applied to the surface of the semiconductor substrate (1) on either side of the conductor path and is covered by a cover layer (6), e.g. a BPSG layer.