发明名称 Polishing slurry and polishing process using the same
摘要 A polishing slurry used for a process of polishing a workpiece by bringing the workpiece in sliding-contact with a polishing plate supplied with the slurry, and a polishing process using the slurry. The slurry includes polishing particles treated with a surface finishing agent having at least a carboxyl group containing material, an amino group containing material, and a sulfonic acid group containing material. The slurry is effective to polish a workpiece without occurrence of scratches on the surface of the workpiece.
申请公布号 US5709588(A) 申请公布日期 1998.01.20
申请号 US19960709824 申请日期 1996.09.10
申请人 SONY CORPORATION 发明人 MUROYAMA, MASAKAZU
分类号 B24B37/00;C09G1/02;C09K3/14;C09K13/06;H01L21/304;(IPC1-7):B24B1/00;B24B7/19;B24B7/30 主分类号 B24B37/00
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