发明名称 FORMATION OF METALLIC CONDUCTIVE LAYER ON SURFACE OF FLUORINE PLASTIC BODY
摘要 PROBLEM TO BE SOLVED: To provide a method which decreases the number of stages, facilitates stage maintenance and reduces a production cost as a method for formation of a metallic conductive layer on the surface of a body. SOLUTION: (1) The surface of the fluorine plastic body, for example, tetrafluoroethylene resin, subjected to a degreasing treatment is first subjected to an activation treatment by an immersion treatment in a sodium metal- naphthalene complex soln., etc., as an activation treatment stage S1. (2) Next, a conductive coating material, for example, a silver conductive coating material contg. conductive particles consisting of silver is applied on the surface of the fluorine plastic body subjected to the activation treatment and is dried to form a ground surface conductive layer as a conductive coating material applying and drying stage S2. (3)) Next, the surface of the ground surface conductive layer is subjected to copper plating by a copper electroplating treatment using a plating liquid of, for example, copper sulfate, to form a copper plating conductive layer, by which the metallic conductive layer is formed on the surface of the fluorine plastic body, as an electroplating stage S3.
申请公布号 JPH1018080(A) 申请公布日期 1998.01.20
申请号 JP19960188292 申请日期 1996.06.27
申请人 TOTOKU ELECTRIC CO LTD 发明人 YAMAGUCHI TATSUO;KITAZAWA HIROSHI;YOSHIMURA SHUNICHI
分类号 H05K1/09;C25D3/38;C25D5/56;C25D7/00;H01B5/14;H01B13/00;H01B13/016;H05K3/24 主分类号 H05K1/09
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