| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg having a low permittivity, a low dielectric loss tangent, good copper foil peel strength and good heat resistance and a laminate for electrical insulation materials. SOLUTION: This invention provides a prepreg prepared by impregnating or coating a base with an epoxy resin composition essentially consisting of an epoxy resin having at least two epoxy groups in the molecule, a copolymer resin essentially consisting of an aromatic vinyl compound and maleic anhydride, a phenol compound having two phenolic hydroxyl groups in the molecule and an oligomer of styrene or a substituted styrene and a laminate prepared by using this prepreg. The laminate has excellent permittivity and excellent heat resistance and good copper foil peel strength and is used for electrical insulation materials. |
