| 摘要 |
A process for forming a hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e.g., gold) coating is applied to the conductive pin before the hermetic seal is formed. The process generally includes providing a noble metal-coated conductive pin, placing glass having a softening point less than about 650 DEG C. into a cavity of the outer body, inserting the coated conductive pin into a bore in the glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700 DEG C., and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.
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