| 摘要 |
PROBLEM TO BE SOLVED: To be able to deal with a significant change in the products quantity in a mold and their size without replacing part of a device and obtain a molding with a presentable appearance and free from a void. SOLUTION: A thermosetting liquid resin 9 contained in a resin tank 10 is sent to and packed in a mold 5 heated at a specified temperature after passing through an injection nozzle 6 by a gear pump 12. Further, an introducing pipe 11 is closed by an on-of valve 13 while the opening part of the mold 5 is opened. Next, a bar-like pin 16 is thrust into an injection nozzle 6 by the length controlled by a regulator 18 to reduce the inner volume of the injection nozzle 6. Consequently, a pressure is applied to the thermosetting resin 9 packed into the mold 5. Thus it is possible to cure the resin under an adequately applied pressure. |
