发明名称 SPUTTERING TARGET OF ALUMINUM OR ALUMINUM ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a high purity aluminum or high purity aluminum alloy sputtering target in which the sudden generation of particles is suppressed. SOLUTION: In a high purity aluminum (alloy) sputtering target, inclusions, particularly, oxides in the target are the main cause of particles. Furthermore, graphite-alumina composite inclusions raretively coarsely distributed in the target cause the sudden increase of particles. Then, the content of oxygen in the target is regulated to <5ppm, and furthermore, the indication equivalent to >=0.5mmϕFlat Bottom Hole in an ultrasonic test executed from the surface of the target is regulated to <0.014 pieces/cm<2> .
申请公布号 JPH1018028(A) 申请公布日期 1998.01.20
申请号 JP19960194152 申请日期 1996.07.05
申请人 JAPAN ENERGY CORP 发明人 FUKUYO HIDEAKI;SAWAMURA ICHIRO;OKABE GAKUO;OHASHI TAKEO;NAGASAWA TAKASHI
分类号 C23C14/14;C22C21/00;C23C14/34;H01L21/285;(IPC1-7):C23C14/34 主分类号 C23C14/14
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