| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently remove the solder sticking to soldered parts by heating a printed circuit board and applying vibration thereon. SOLUTION: When the printed circuit board P hung to the hook 15 of a transporting device 12 comes to the center of a preheating zone 6, the device is stopped for the specified time and the circuit board P is heated to 100 to 150 deg.C. When this temp. is attained, the circuit board 6 is admitted into the heating zone 7 and when the circuit board comes to the center, the device is stopped. In this zone, the circuit board P is heated to a temp. higher than in the preheating zone 6 and the vibration is applied thereon. The vibration is applied on the circuit board P via a mounting plate 16 of the hook by a vibration device 17. The solder is extremely weakened in its mechanical strength and is made brittle when the tap. of the circuit board P attains the solidus line of the solder. The solder sticking to the circuit board P easily peels from the circuit board P when the circuit board P vibrates in this state. Further, the solder infiltrating through-holes is splashed off by the vibration. The removed solder falls into a drawer 11 in the lower part of a main body 2 and accumulates therein.</p> |
