发明名称 |
T-DIE WITH DECKLES |
摘要 |
<p>PROBLEM TO BE SOLVED: To easily and efficiently remove resin residing in the manifold of a T-die. SOLUTION: This T-die with deckles consists of a molding die main body 1 which has a manifold 2 for storing a molten resin formed in the longitudinal direction and discharges the molten resin from an opening formed at the lower end of the manifold 2, a pair of deckles 7 inserted airtightly into the manifold 2 from both ends in freely sliding manner and a pair of side plates 6 which close both ends of molding die main body 1 and have the deckles 7 inserted through the side plates 6. Further, the T-die is equipped with a drawing mechanism 34 which draws the deckles 7 to the outside of the side plates 6 in the longitudinal direction of the deckles respectively and a transfer mechanism 60 which transfers the deckles 7 drawn to the outside of the side plates 6 together with the drawing mechanism 34 and thereby exposes the end face of the manifold 2.</p> |
申请公布号 |
JPH1016031(A) |
申请公布日期 |
1998.01.20 |
申请号 |
JP19960166497 |
申请日期 |
1996.06.26 |
申请人 |
FUJIMORI KOGYO KK;KOSHIN ENG:KK |
发明人 |
FUKANO KATSUNORI;SHINOHARA CHIGIRI;HORIE TADAO;OZAKI TADAHIKO |
分类号 |
B29C47/16;B29C47/08;B29C47/92;B29L7/00;(IPC1-7):B29C47/16 |
主分类号 |
B29C47/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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