发明名称 MOLD ASSEMBLY WITH MEANS TO SEAL THERMOSTATED LIQUID FOR MOLDING PHOTODISC
摘要 PROBLEM TO BE SOLVED: To attach an improved sealing means for the prevention of hot water leakage to outside the device. SOLUTION: This mold assembly with a means to seal thermostated liquid for molding a photodisc consists of a mold assembly (C) on the cavity side and a mold assembly (D) on the force side, passageways 26, 40 for a thermostated liquid formed with disc cavity plates 25, 35 and fitting plates 31, 48 provided on each of the assemblies (C) (D) and a means to seal a thermostated liquid provided either on the inner periphery of the outer periphery of the passageways 26, 40 for a thermostated liquid. In addition, the means to seal a thermostated liquid is constituted of an annular hole formed between the disc cavity plates 25, 35 and the fitting plates 31, 48 respectively either on the inner periphery or the outer periphery of the thermostated liquid passageways 26, 40, rigid ring 32, 49 to be inserted into the annular hole with a left microfine clearance, and a heat-resistant sealing filler packed between the inner wall face of a groove and the outer periphery of the metal rings 32, 49.
申请公布号 JPH1016021(A) 申请公布日期 1998.01.20
申请号 JP19960195342 申请日期 1996.07.05
申请人 SEIKO GIKEN:KK 发明人 TAKAHASHI MITSUO
分类号 B29C33/00;B29C33/04;B29C45/26;B29C45/73;B29L17/00;(IPC1-7):B29C45/73 主分类号 B29C33/00
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