发明名称 Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor
摘要 A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.
申请公布号 US5709979(A) 申请公布日期 1998.01.20
申请号 US19940327236 申请日期 1994.10.21
申请人 SHELDAHL, INC. 发明人 CASSON, KEITH L.;SAARI, MATTHEW JOHN;MARSOLEK, RAPHAEL A.;TIBESAR, MARION
分类号 H05K1/11;H05K3/00;H05K3/28;H05K3/42;H05K3/46;(IPC1-7):G03F7/00 主分类号 H05K1/11
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