发明名称 |
Apparatus and method for automatic monitoring and control of stencil printing |
摘要 |
A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.
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申请公布号 |
US5709905(A) |
申请公布日期 |
1998.01.20 |
申请号 |
US19970789252 |
申请日期 |
1997.01.28 |
申请人 |
MOTOROLA, INC. |
发明人 |
SHAW, MICHAEL F.;SUPPELSA, ANTHONY J.;ADAMS, DALE R. |
分类号 |
H05K1/02;H05K3/12;(IPC1-7):B05D1/32;B05C11/02;B05C3/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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