| 摘要 |
<p>PCT No. PCT/EP93/03043 Sec. 371 Date Jul. 25, 1995 Sec. 102(e) Date Jul. 25, 1995 PCT Filed Mar. 31, 1993 PCT Pub. No. WO94/12009 PCT Pub. Date May 26, 1994The leads of a lead frame on which an encapsulated chip is placed are bent by placing them in a mould and subsequently bending them with a bending tool in the form of a cylinder-like roller rotatable round a rotating shaft. Because the roller rolls off over the leads, scraping off of solder onto the leads is prevented during bending. In view of its length the mounting of such a roller causes problems, such as sagging. This is resolved according to the invention by providing the roller on the periphery with slot-like recesses for passage of a bearing for the rotating shaft.</p> |
