WIRING BOARD, MANUFACTURE THEREOF, WIRING BOARD MOUNTED WITH BOARD, AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and method by which positioning and bonding of a flip chip, etc., can be easily realized with a good accuracy, and also to provide a wiring board having a board mounted thereon and a method for manufacturing the same. SOLUTION: A wiring board 3 is coated on its all surface (including connecting pads 17) with known photosensitive epoxy resin to form a photosensitive epoxy resin layer 21 of 0.4mm thick. Next, an exposing mask 25 having holes 23 made only in projection formation parts is mounted on the photosensitive epoxy resin layer 21 and subjected to exposure of ultraviolet rays only at the projection formation parts of the resin layer 21. Thereafter, the board is developed to remove excessive resin to thereby form positioning of projections 4 made of the resin.