| 摘要 |
PROBLEM TO BE SOLVED: To highly efficiently manufacture a multilayered printed wiring board constructed in an IVH structure with high yield without causing troubles by a de-smearing process, by providing via holes by filling up through holes formed through the wiring board so that the holes can reach conductor circuits with conductive paste so that the surface of the paste can be flushed with or protruded from the surface of the wiring board. SOLUTION: A multilayered printed wiring board 1 is composed of hard insulating substrates 2a and 2b, conductor circuits 3a and 3b which are formed by etching metallic foil stuck to one surfaces of the substrates 2a and 2b, and adhesive agent layers 4a and 4b provided on the conductor circuit forming surfaces of the substrates 2a and 2b. Then, single-sided circuit boards 7a and 7b having via holes 6a and 6b formed by filling up holes formed through the substrates 2a and 2b so that the holes can come into contact with the circuit 3a and 3b with conductive paste 5 are laminated upon both surfaces of the core substrate 8 of the wiring board 1. |
