| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a measurement which cannot be performed in a finished product state can be performed in a wafer state. SOLUTION: A semiconductor device 2 has probe pads 151 -156 , banding pads 11-13 and a thin film wiring, and further, it has a bonding wiring 17 which is a part of the thin film wiring and connected to the probe pad 151 . When an end of a metal wire 18 is fixed to the bonding pad 13, it is fixed to the bonding wiring 17 or the probe pads 151 -156 together. So that, before wire banding, an inspecting probe is made to contact with each bonding pad 11-13 and each probe pad 151 -156 to operate an internal circuit individually, so that an electric test can be performed. On the other hand, at wire bonding, the bonding pads 11-13 can be connected to the probe pads 151 -156 without providing a special process. |
