| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent a thin-film wiring conductor from being disconnected by increasing the junction strength between a conductive layer formed on the inner wall of the through hole of an insulation substrate and an organic resin filling body and preventing the position deviation of the organic resin filling body. SOLUTION: A wiring board consists of an insulation substrate 1 with a through hole 5 that penetrates through both upper and lower main surfaces, a conductive layer 6 that is led from the upper surface of the insulation substrate 1 to the lower surface via the inner wall of the through hole 5, an organic resin filling body 7 filled into the inside of the through hole 6, and a multilayer wiring part 4 deposited on at least one main surface of the insulation substrate 1 having alternately an organic resin insulation layer 2 and a thin-film wiring conductor 3, and at the same time where one part of the thin-film wiring conductor 3 is electrically connected to the conductive layer 6. In this case, the region of the inner wall of the through hole 5 of at least the insulation substrate 1 of the conductive layer 6 is formed by metal whose main constituent is nickel. |
