| 摘要 |
PROBLEM TO BE SOLVED: To prevent a gap from being formed between stacked insulating substrates by arranging an insulating layer which fills the gap between wiring conductors between the insulating substrates where wiring conductors are arranged. SOLUTION: The wiring substrate has an insulating base body 1 formed by vertically stacking insulating substrates 1a to 1c formed by binding 60 to 95wt.% inorganic insulator powder with 5 to 40wt.% thermosetting resin and wiring conductors 2 which are arranged between the vertically stacked insulating substrates 1a to 1c and formed by binding metal powder with thermosetting resin; and insulating layers 5 which fill gaps between the wiring conductors 2 are arranged between the insulating substrates 1a to 1c where the wiring conductors 3 are arranged. |
