发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To restrain the cost of inner layer pattern inspection and enable an inner layer pattern to be subjected to inspection which is suitable for high density level by arranging each inner layer pattern with a front and a rear thereof reversed and arranging each inner layer board not reversed but turned 180 deg.. SOLUTION: When a piece 6a alone is reversed, for example, a mounting surface 1 and a mounting surface 4 are reversed; however, each inner layer pattern 5 is not reversed but turned 180 deg.. As a result, the inner layer pattern 5 is classified into a layer surface having a high density pattern 2 of a piece 6a and a non-high density pattern 2 of another piece 6b and a layer surface having a high density pattern 3 of the piece 6a and the high density pattern 3 of another piece 6b. The inner layer pattern 5 can be subjected to an appearance inspection whose method is suitable for each thereof. Therefore, a layer surface which is edited by the non-high density pattern 2 is subjected to a simple inspection and a layer surface which is edited by the high density pattern 3 is subjected to an inspection corresponding to high density.
申请公布号 JPH1013040(A) 申请公布日期 1998.01.16
申请号 JP19960167896 申请日期 1996.06.27
申请人 NEC TOYAMA LTD 发明人 TERANISHI HIDEKI
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
代理机构 代理人
主权项
地址