| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board for manufacturing a printed wiring board with a high board-thickness accuracy easily. SOLUTION: A mirror plate 8 used when manufacturing a printed wiring board is directly heated by high-frequency induction heating using a heating coil 16, and the prepreg of a lamination body 7 is heated and melted with the heat. In this case, since the mirror plate 8 is located extremely near the lamination body 7, generation of time delay due to heat conduction is small, an optimum temperature profile for melting and curing the prepreg can be obtained in all multilayer printed wiring boards, thus obtaining a multilayer printed wiring board with a high board-thickness accuracy. |
