| 摘要 |
PROBLEM TO BE SOLVED: To improve an insert-ring buried in an attaching hole of a resin case so that stable fixing is provided when a package is screwed to a cooling fin and an appropriate layer thickness of a bonding agent is assured between an enclosing resin case and a metal base plate. SOLUTION: Relating to a semiconductor device wherein, in an attaching hole 4a of an enclosing resin case 4 incorporated with a terminal which is bonded to a metal base plate 1 on which a power semiconductor element is mounted, a metal insert-ring 10 is molded, together with the resin case into one body, the insert-ring 10 is constructed of a drawing metal plate wherein a constriction part 10a is molded at the periphery of its barrel part and a through hole 10b for an attaching screw is punched out at its upper surface, and molded into a hat shape, Its lower and periphery part is insert-molded to the resin case while it is protruded by about 0.2mm, corresponding to the layer thickness of a bonding agent, below the bottom surface of the enclosing resin case. |
