| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit element which can prevent warpage and short-circuiting of corner bonding wires in wire bonding and molding steps to thereby improve reliability in the bonding wires. SOLUTION: In order to increase spacings d1 and d2 between corner bonding wires 118, corner electrode pads 120 are positioned as shifted inwardly of a semiconductor chip 110 or a wire span of the corner bonding wires 118 is made short. To this end, comer inner leads 116 are extended by an extra amount to be close to the chip 110, whereby tip ends of the leads draw a curve. |
