MANUFACTURE OF LEAD FRAME FOR IC AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To make an inner lead pitch narrower and to extend the tip of an inner lead to the vicinity of an IC chip by providing a longitudinal step in the adjacent tip parts of respective inner leads. SOLUTION: A die pad 3 for mounting an IC chip 2 is provided in the central part of a rectangular frame 1. A plurality of elongated inner leads 4 integrally formed with the frame 1 are extended toward the die pad 3 from the counterposed parts of the frame 1 with gaps 4a provided between the inner leads 4. Particularly, a longitudinal step is provided in the adjacent tip parts of the inner leads. Therefore, the lateral area limited by the lead spacing in the conventional inner lead design can be narrowed, so that narrower inner lead pitch can be realized. Thus, the tips of the inner leads can be extended to the vicinity of the IC chip.