| 摘要 |
PROBLEM TO BE SOLVED: To reduce failures due to connection failure of a mounting coupler terminal by connecting the power source electrode of a semiconductor element to the mounting coupler terminals positioned at the four corners of a square annular arrangement and connecting the power source electrode and the grounding electrode of the semiconductor element also to the mounting coupler terminals positioned at the points other than the four corners. SOLUTION: A semiconductor element 2 is stored in a recessed part 5 formed on the top plane of a semiconductor element storing package 4, and on the bottom plane of the semiconductor element storing package 4, a plurality of almost spherical mounting coupler terminals 6, which connect the electrode 3 of the semiconductor element 2 at the outermost part, are arranged in square annular shape. Then, the power supply electrode and the grounding electrode among the electrodes 3 of the semiconductor element 2 are connected to the mounting coupler electrode 6 and also to the mounting coupler terminals 7 positioned at the outermost tour corners of the square annular arrangement. Thus, failures due to connection failure of the mounting coupler terminals 6 and 7 are reduced, and reliability after mounting is improved. |
