| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield by preventing faulty development caused by bubbles produced in a paddle for liquid developer of resist on a board, when minuscule resist patterns are formed on the board. SOLUTION: A resist-developing apparatus is provided with a nozzle 4, including more number of discharge openings than a conventional apparatus and which is placed with a reduced height h2 from the surface of a wafer W, in order to reduce dropping energy of resist developer. A paddle P is formed on the wafer W. Bubbles produced in the paddle are substantially reduced, in comparison with a conventional apparatus. The bubbles are thoroughly removed by irradiating the paddle during development with ultrasound U from an ultrasound generator 8, which is placed above a development cup 1. Other solutions are possible for eliminating bubbles: a flat plate provided with minuscule protrusions is brought into contact with the paddle P, or dip-type development is combined with irradiation of ultrasound is effective also. |
