| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact multilayer wiring board with a high wiring density, by setting a wiring conductor to a thin-film wiring conductor formed by the thin-film formation technique and at the same time incorporating a capacitance element inside the conductor. SOLUTION: A wiring board consists of an insulation substrate 1 with a through hole 5 that penetrates through both upper and lower main surfaces, a conductive layer 6 led from the upper surface of the insulation substrate 1 to the lower surface via the inner wall of the through hole 5, an organic resin filling body 7 filled into the inside of the through hole 6, and a multilayer wiring part 4 deposited at least on one main surface of the insulation substrate 1 and alternately laminated on an organic resin insulation layer 2 and a thin-film wiring conductor 3, and at the same time where one part of the thin-film wiring conductor 3 is electrically connected to the conductor layer 6. In this case, a through hole 10 is provided at least on one layer of the organic resin insulation layer 2, a dielectric material filling body 11 made of a dielectric material filler whose specific dielectric constant is 20 or larger and an organic resin is filled into the through hole 10, at the same time one part of the thin-film wiring conductor 3 is arranged oppositely on the upper and lower surfaces of the dielectric material filling body 11, and a capacitance element A is electrically connected between the thin-film wiring conductors 3. |
