| 摘要 |
PROBLEM TO BE SOLVED: To provide a high power circuit board in which breakdown strength and heat dissipation are enhanced while suppressing warp, a method for producing the circuit board stably at high productivity and an electrically reliable hybrid integrated circuit strong against heat shock. SOLUTION: When a board for hybrid integrated circuit is produced by forming an Al circuit 3 of 200-1000μm thick on an Al board 1 through an insulating adhesive layer 2 and then forming a copper plating layer 4 partially on the Al circuit 3, an Al foil is bonded onto the Al board 1 through the insulating adhesive layer 2, the copper plating layer 4 is formed thereon and then a circuit is formed. Furthermore, an electronic device is soldered and/or bonded through a wire to the board thus forming a hybrid integrated circuit.
|
