| 摘要 |
PROBLEM TO BE SOLVED: To obtain the semiconductor integrated circuit and its manufacture which can correspond with other kinds of package only by changing only the part of a semiconductor manufacture process. SOLUTION: Pad driver cells 21 to 23 are provided as many as or more than input/output control circuits 11 to 13. In a wiring area LIN, polysilicon wires 111 to 133 are led out of input terminals IN and output terminals CP and CN of the respective input/output control circuits 21 to 23. Polysilicon wires 211 to 233 are led out of input terminals CP and CN and output terminals IN of the pad driver cells 21 to 23. |
