| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a multiple chip electronic component wherein, when swarf and evaporized materials stick to a part between surface film type electrodes of both sides of a chip substratum which are produced by adjustment or the like of electronic element bodies formed on the chip substratum, bridges or short circuit are not caused at the plating process of an electrode plating layer in the later processes, and a manufacturing method of it. SOLUTION: A plurality of pairs of surface film type electrodes 12 are formed on the surface of an insulating chip substratum 10 along both side edges facing each other. The respective electronic element bodies 13 are formed between the surface film type electrodes 12 of both sides making pairs. Protective films 15, 17 are formed on almost the entire surface containing space parts 14 between the adjacent surface film type electrodes 12, exposing the surface film type electrodes 12 on the surface of the chip substratum 10. Electrode plating layers 18 are formed on the surface film type electrodes 12, on the end surface of the chip substratum 10.</p> |
