LED DISPLAY PACKAGE FROM WHICH SUBSTRATE IS REMOVED AND PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To integrate a driver circuit for driving an LED array and a large LED array while reducing the are of semiconductor chip required for the large scale element array. SOLUTION: An LED array 14 on a substrate 12 is provided with row and column connection pads being led to display connection pads 22 arranged on the uppermost surface on an LED array element 10. An independent silicon driver element 25 is provided with connection pads 28 being led to the uppermost surface and arranged to be aligned with the connection pads 22 of the LED array element 10 in con junction therewith when they are stacked correctly. The LED array element 10 is jointed to the driver element 25 through flip-chip bumps using a standard C5DCA. An underfill layer is arranged in a space defined by the LED array element 10 and the driver element 25. The substrate 12, on which the LED array is formed originally, is then removed selectively. Light is emitted from the LED array element 10 through the residual indium phosphide-gallium-aluminum.