MODULE ELECTRONIQUE

摘要

The electronic module (10) is in the form of a thin parallelepiped has front and rear faces (11) (12). Several electronic components are located inside the module and their external connections are made via an array of bumps (13) on the rear face. The bumps are regularly spaced by a distance (p) and are connected to a printed circuit. A zone (14) of the array of bumps is assigned to testing and programming and is not connected to the printed circuit. The bumps in this zone are arranged at double spacing (2p).