| 摘要 |
PROBLEM TO BE SOLVED: To stabilize island portion by providing a suspension pin at a required place when provision of a suspension pin at an island portion required is difficult because a pullout terminal is located at one side only of a package and a lead for connecting to a pad at opposite side is provided surrounding the island portion in a semiconductor device to be formed by using a lead frame. SOLUTION: A pad 4b at the opposite side of the pullout terminal is divided into two parts 1a and 1b, and a suspension pin 6 required is provided between the end portions 1a1 and 1b1 of the lead. A pad 4c is provided on the wiring 7 of a semiconductor chip 2, and the lead frame 1a and b are electrically connected by connecting with the ends 1a1 and 1b1 and bonding wire 3c. |
