| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can reduce a stress to be applied to a molding, improve a dimensional accuracy in the molding and also improve a reliability in the semiconductor device. SOLUTION: While upper ejector pins 14 of an upper metallic mold 12 push one face of a molding 11 against a lower metallic mold 13, the upper metallic mold 12 is moved upwards to be separated from the molding 11. Again the molding 11 is compressed by the metallic molds. And while lower ejector pins 15 push one face of the molding 11 against the upper metallic mold 12, the lower metallic mold 13 is moved downwards to be separated from the molding 11. In this method, when the molding 11 is separated from the mold, the molding is always stably carried by the face of the opposing mold. Thereby the molding 11 can be less deformed and thus a semiconductor element held within the molding 11 can be less stressed. |
