| 发明名称 |
Cyanate resin composition and copper-clad laminate |
| 摘要 |
<p>A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B). (A) a cyanate compound of the formula: <CHEM> wherein R and Q each represents halogen, C1-10 alkyl, C5-7 cycloalkyl or C6-20 hydrocarbon; i and j each represents 0-4 and M is (2): <CHEM> wherein T represents halogen, C1-10 alkyl, C5-7 cycloalkyl or C6-20 hydrocarbon; k represents 0-10 and m represents 0-8, and (B) a hardener.</p> |
| 申请公布号 |
SG45135(A1) |
申请公布日期 |
1998.01.16 |
| 申请号 |
SG19960000054 |
申请日期 |
1994.02.22 |
| 申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
ENDO YASUHIRO;UEDA YOICHI;HAYASHI TOSHIAKI;SHIBATA MITSUHIRO;KITAYAMA SHINICHIRO;KANAGAWA SHUICHI;WATABU HISASHI |
| 分类号 |
C08G59/40;C08G73/02;C08G73/06;H05K1/03;(IPC1-7):C08G73/06;B32B15/20;C08G73/12 |
主分类号 |
C08G59/40 |
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