发明名称 MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate for eliminating troubles caused by the stress in burning. SOLUTION: An insulation layer made of a five-layer alumina is laminated, a through groove for wiring in a layer is formed at insulation layers 2 and 3, and a wiring material 8 in layer is arranged in the through groove for wiring in a layer. The wiring material 8 in layer has a band shape, where it is 0.25mm thick and 10mm wide. An arc part 11 (R part) with a radius of curvature (R) of 0.25mm is provided at four corners of a rectangle in the wiring material 8 in layer, and the corner of the wiring material 8 in layer is chamfered. Stress at the corner can be relaxed in burning and the generation of a crack at the insulation layers 2 and 3 with the corner part of the wiring material 8 in layer as a starting point can be suppressed.
申请公布号 JPH1013018(A) 申请公布日期 1998.01.16
申请号 JP19960161607 申请日期 1996.06.21
申请人 DENSO CORP;KYOCERA CORP 发明人 ASAI YASUTOMI;OTA SHINJI;NAGASAKA TAKASHI;NAKAGAWA SHOICHI;TERAO SHINYA;AIHARA KENICHI;FUKUDA JUN;OKUNOSONO TAKASHI
分类号 H05K1/02;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
代理机构 代理人
主权项
地址