LEAD FRAME, RESIN-SEALED SEMICONDUCTOR DEVICE USING THE LEAD FRAME AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To prevent peeling of a rear surface of a die pad from seal resin and package cracks generated at the mounting step of a semiconductor package by providing a recess part to surround the center of a mounting surface on a semiconductor chip mounting surface of the die pad of which size is smaller than the semiconductor chip. SOLUTION: A die pad 3a has a such construction as a square of the die pad 3a being smaller than one of a semiconductor chip 1 which is mounted thereon. A gap shaped recess part 4 is so formed as to surround the center of the inside of the semiconductor mounting surface of the die pad 3a. The gap shaped recess part 4 can traps surplus first adhesive agent 2 in the gap shaped recess part 4 even in case of the first adhesive agent 2 applying all over the die pad 3a, therefore the first adhesive agent 2 can be applied more than the need of adhesion of the semiconductor chip 1 with the die pad 3a. By the means controlling of application quantity can easily be made. Also more excellent package crack resistance can be realized.