发明名称 METHOD AND EQUIPMENT FOR MEASUREMENT AND METHOD AND EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To improve the measuring accuracy in a measured value of the size of a material to be measured, such as an Au (gold) ball, and also to improve the operating efficiency of a measuring operation. SOLUTION: This equipment for measurement comprises a stage 4 for measurement which supports and moves an Au ball 3b formed in the wire end part of an Au wire being used in wire bonding, a CCD camera 5 which picks up an image of the Au ball 3b supported by the stage 4, an image processing part 6 which determines the size of the Au ball 3b by conducting an image processing on the basis of the information on the image of the Au ball 3b picked up by the CCD camera 5, a monitor 7 which displays the result 5a of the image processing and a printer 8 which outputs the information 8a on the size of the Au ball 3b determined by the image processing part 6, and measurement of the size of the Au ball 3b is conducted automatically by the image processing part 6.
申请公布号 JPH109830(A) 申请公布日期 1998.01.16
申请号 JP19960160364 申请日期 1996.06.21
申请人 HITACHI LTD;HITACHI YONEZAWA ELECTRON CO LTD 发明人 SUZUKI TAKESHI;TANAKA YUICHI;SOGA SATOSHI
分类号 G01B11/08;H01L21/60;H01L21/66 主分类号 G01B11/08
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