| 摘要 |
A radiation curable composition comprising: (A) at least one compound containing a (meth)acrylate group represented by formula (1), wherein R1 is a hydrogen atom or a methyl group, R2 is an alkylene group or a hydroxyalkylene group having 2 to 6 carbon atoms, R3 is a divalent organic group, n is a number of 1 to 10, m is an integer of 0 or 1, and Ar1 and Ar2 are independently a group comprising an aromatic ring; (B) at least one compound derived from trishydroxyethyl isocyanurate, and containing at least one (meth)acrylate group; and (C) at least one radiation polymerization initiator. The radiation curable resin composition affords a high productivity, exhibits high transparency, and produces molded articles exhibiting minimal coloration upon exposure to light, superior dimensional precision, high heat resistance, only slight adhesion to substrates under high temperature conditions. The composition is very useful for manufacturing molding articles. |
