发明名称 |
Integrated electro-optical package and method of fabrication |
摘要 |
An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate.
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申请公布号 |
US5708280(A) |
申请公布日期 |
1998.01.13 |
申请号 |
US19960667552 |
申请日期 |
1996.06.21 |
申请人 |
MOTOROLA |
发明人 |
LEBBY, MICHAEL S.;JIANG, WENBIN;JACHIMOWICZ, KAREN E. |
分类号 |
H01L33/00;H01L27/15;H01S5/00;H01S5/022;H01S5/323;H01S5/343;H01S5/42;(IPC1-7):H10L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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