| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition which contains a resin soluble in an organic solvent, an inorganic filler and a resin filler slightly soluble in an organic solvent, enables printing on a fine part, for example, the top end of a lead frame finger without anxiety about adverse effect on the circuit and is useful for electronic parts. SOLUTION: This adhesive composition contains (A) 100 pts.wt. of a resin soluble in an organic solvent comprising a polyimide resin having a glass transition temperature of 100-250 deg.C, a viscosity of 0.5-20Pa.S, soluble in an organic solvent, and contains 2-50mol.% of a silicone diamine based on the whole diamines, represented by the formula (R1 and R2 are each a divalent 1-4C aliphatic or an aromatic group; R3 -R6 are each a monovalent aliphatic or aromatic group; (k) is 1-20), (B) 2-20 pts.wt. of an inorganic filler, for example, spherical silica with an average particle size of 0.005-0.1μm and (C) 5-50 pts.wt. of a resin filler, for example, a polyimide powder which is slightly soluble in organic solvent and has an average particle size of 1-30μm. In an preferred embodiment, the weight ratio of the solid components to the solvent is 0.3-3 and the viscosity of the composition is 950-1,500Pa.S.
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