| 摘要 |
PROBLEM TO BE SOLVED: To prevent the oxidation before alloying of fused solder caused in fusing an An-Sn multi-layer solder. SOLUTION: In this Au-Su multi-layer solder obtained by alternately film- forming and laminating Au thin layers 5, 7, 9, 11 and Sn thin film layers 6, 8, 10 on a mounting board 13, the uppermost layer of the multi-layer solder is constituted of the Au thin film layer 5, and the Sn thin film layer is formed at the film thickness of <=3000Åin terms of bulk density. The Au thin film layer and the Sn thin film layer are formed at the same degree of film thickness respectively, and constitute the solder eutectic mixed material having 80wt.% Au.
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