| 摘要 |
A low-profile zero-insertion socket includes a plurality of resilient contacts mounted directly into the motherboard. The socket has a support plate slidingly attached to the motherboard and including a plurality of through apertures formed to receive the pins of a microprocessor package. A low-profile eccentric cam actuator, rotationally coupled to the motherboard, is provided for moving the support plate that bears the microprocessor to and from a position where the microprocessor pins engage the resilient contacts.
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