发明名称 LASER BEAM MACHINING APPARATUS AND METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To efficiently execute the machining to cutting position in the inner parts of plural chips and to shorten the treating time for all materials to be machined by using a laser beam machining optical system composed of plural pieces of light condensing means sharing one shaft in a laser beam machining apparatus. SOLUTION: This laser beam machining apparatus 30 is constituted of laser beam oscillating sources 14, 14' for generating the laser beams, a laser beam scanning means 31 containing optical system light condensing means 18, 19 which are arranged so as to condense the laser beams and irradiate the material 20 to be machined, and shifting the laser beams so as to condense the laser beams and irradiate prescribed positions of the material 20 to be machined and stages 11, 12, 13 constituted so as to be shiftable while loading the material 20 to be machined. The laser beam scanning means 31 is provided with the light condensing means 18, 19 each having one common driving shaft so as to be shiftable along the preset one axial direction and controlling means 16, 16' for independently controlling the irradiation of the laser beams in the light condensing means 18, 19, respectively.</p>
申请公布号 JPH106049(A) 申请公布日期 1998.01.13
申请号 JP19960153614 申请日期 1996.06.14
申请人 NEC CORP 发明人 KAJIKAWA TOSHIKAZU
分类号 B23K26/00;B23K26/08;H01L21/82;H01S3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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