| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste for die bonding excellent in resistances to stain and soldering crack by compounding a silver powder, a specific epoxy compd. mixture, a curative, an ion scavenger, and a monoepoxy compd. and/or a solvent. SOLUTION: This paste comprises a silver powder (A), an epoxy compd. mixture (B) which comprises a bisphenol F epoxy compd. represented by formula I (wherein n is 0-2) and an epoxy compd. represented by formula II and which contains 90-98wt.% compd. represented by formula I wherein n=0 and 2-10wt.% compd. represented by formula II, a curative (C), an ion scavenger (D), and a monoepoxy compd. and/or a solvent (E). Pref. this compsn. comprises 60-85wt.% A, 15-40wt.% B, 0.01-2wt.% C, 0.1-5.0wt.% D, and lower than 5wt.% E. |
